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solder joint reliability
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  1. EPSI Inc. - Electronics Packaging Solutions International Inc.

    EPSI INC. - Electronics Packaging Solutions International Inc. P.O. Box 1522, Montclair, NJ 07042 USA, tel.: +1 (973)746-3796, fax: +1 (973)655-0815 e-mail: ...
    CSP1
    BGA1
    Electronic Packaging1
    Flip-Chip1
    Lead-Free Solder1
    Design for Reliability1
    Solder Joint Reliability1

    www.jpclech.com - 2009-02-07

  2. Home of wafer level packaging folks

    Information about Wafer Level Packaging (WLP) technologies for all WLP folks. Just go through all the articles available here and post yours if you would.
    polymer2
    CSP1
    solder1
    DRAM1
    interconnection1
    sputtering1
    flip chip1
    redistribution1
    bumping1
    RDL1
    UBM1
    WLP1
    wafer bumping1
    solder flux1
    Wafer level packaging1
    electromigration1
    solder joint1
    solder bumping1
    solder bump1
    Wafer level package1
    solder joint reliability1
    polymer dielectric0
    polymer passivation0
    solder ball mounting0
    under bump metalurgy0

    www.semitechnik.com - 2009-02-06

abr2 csp1 plasma2 etch1 bga1 sputtering1 ubm1 jvx 6200i1 deposition2 process control2 for sale4 coating2

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